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Baidu released DuerOS intelligent chip AI + chip industrialization direction by algorithm
Number:377   Date:2017-03-31  

          In competitors including TSMC, samsung, Romania, etc. Not only announce in 10 metric process for mass production, continue 7 nai metric process layout, and even more advanced 5 nanometers, three metric.In semiconductor leading Intel (Intel) for each generation processor performance improvement is considered to be "squeeze", even in the eighth generation processor is still using 14 nai metric on the process of cheng, let people suspect Intel´s progress in process technology.And in order to dispel the idea that Intel has released its latest EMIB technology, to prove himself in the processor is still the leading status in production technology.
         According to Intel in 28 held in San Francisco, Intel Technology and Manufacturing Day 2017 conference announced the latest EMIB Technology, its purpose is to use in solving the contradiction between the processor performance and cost issues., said Intel processor on the market at present all components use the TongYiZhi range, or are all 22 nanometers, or all of them are 14 nanometers., even in the future will also enter the era of 10 nanometers, 7 nai metric cheng.However, so will cause development costs rise sharply because of the process of the upgrade, is not conducive to maintain product prices.
As a result, Intel´s new concept more EMIB embedded chip interconnection is introduced, and is to solve the conflict between the processor performance and price.In simple terms, the concept of EMIB different process of the component is allowed to be together, to achieve the purpose of higher cost performance.In the processor, for example, the circuit part with less than the advanced process, it still USES the 22 nai metric routine production, and bear the chip part of the core tasks, due to higher efficiency and lower power consumption, use 10 nanometers or 14 nai metric to manufacture.
Intel says, using EMIB technology will not cause the loss of the overall performance of the chip, it can improve transmission efficiency between the parts.Its speed can reach hundreds of Gigabytes, more than the traditional chip technology, but also reduce the delay of four times.It is understood that this technology is expected in 2018 will begin to production, to compensate with rival Intel on the process of gap.


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